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Technologies & Products Ultra-HDI
Ultra HDI

Ultra-High-Density Interconnect PCBs

As the trend towards miniaturization accelerates, the demand for PCBs with increasingly smaller and intricate features has grown. Ultra-High-Density Interconnect PCBs meet this demand, offering exceptional wiring density that facilitates more sophisticated and compact designs.

Ultra high density interconnect multilayer rigid PCB.
Microsection of a 4-layer rigid PCB with 30 micrometers thin dielectric thickness.
Very thin double layer flex PCB with a thickness of 12 micrometers.

Key Characteristics of Ultra HDI PCBs:

Thin traces and spaces:

Feature size of 50 μm and below.

Microvias:

Diameter of 75 μm and below

Dielectric thickness:

50 μm and below

Cutting-Edges Substrates Requiring Cutting-Edge Equipment and Processes

These PCBs can be either rigid or flexible and typically incorporate multiple layers to manage the high density of connections. Multi-layering is vital for maintaining signal integrity and reducing electromagnetic interference. Advanced substrates are often utilized to improve thermal management and enhance electronic performance.

Producing Ultra HDI PCBs demand advanced processes and equipment. Techniques such al laser direct imaging (LDI) and laser drilling are crucial. Additionally, testing equipment like automated optical inspections (AOI) and electrical testing (e-test) must be capable of handling these small features. To achieve high yields, manufacturing must occur in a clean, temperature- and humidity-controlled environment.

Ultra high density interconnect rigid PCB.

Essential for High-Performance Compact Electronics

Ultra-HDI PCBs are crucial in modern electronics where space is limited, but performance and functionality requirements are high. They are commonly found in advanced computing, smartphones, 5G telecommunications, medical devices such as hearing aids, consumer electronics, wearable devices and biomedical imaging systems such as x-ray, MRI and ultrasound.

GS is a leading provider of ultra-HDI PCBs, recognized for its expertise and extensive experience in the industry. Our production capabilities are exemplified by our high-volume manufacturing, consistently delivering PCBs with line and space dimensions of 40 μm and substrate thickness of 12 μm, even at quantities exceeding several million pieces per year.

Advantages of Ultra-HDI PCBs

Weight and Size Reduction

Ultra-HDI PCBs contribute to the miniaturization of electronic devices, reducing their overall weight and size without compromising performance.

Increased Component Density

These PCBs allow for higher number of components to be places in a smaller area.

Improved Electrical Performance

The reduced distances between components and the shorter electrical paths result in lower signal loss, reduced parasitic capacitance, and inductance, leading to better signal integrity and faster signal transmission.

Greater Design Flexibility

The ability to incorporate multiple layers and complex routing options, provides designers with greater flexibility in BCP design, allowing for more innovative and sophisticated electronic products.

Unlock Superior Performance with Ultra-HDI

Connect with our expert engineers to explore how Ultra-HDI can significantly enhance the performance of your product.

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