Technologies & Products

Technologies & Products

Advanced Technology for the Manufacturing of  Cutting-Edge PCBs

At GS, we excel in producing highly miniaturized and reliable flexible, rigid-flex and multilayer printed circuit boards (PCBs). Our advanced manufacturing techniques encompass both the traditional subtractive method and the highly advanced semi-additive process (SAP).

We handle substrates as thin as 12 μm and lines and spaces as fine as 10 μm. Our extensive expertise and technology empower us to meet demanding specifications, bringing your most compact and sophisticated designs to fruition.

Basic PCB Types

Long flexible PCB with coverlay.

Offering remarkable design versatility and durability, flexible PCBs can replace traditional cables and connectors while withstanding extensive dynamic bending. They are the key to creating the thinnest, smallest and lightest electronic devices, making them ideal for the demands of today’s highly miniaturized electronic devices.

Rigid PCB with hole in the center and castellations on the edges.

They are the most widely used type of PCB, ideal for complex circuit designs due to their ability to support a high number of layers. Their stiffness allows them to handle heavy components, ensuring durability and reliability. The well-established assembly process for rigid PCBs makes it easy to find experienced assembly houses guaranteeing reliable and efficient production.

Rigid-flex PCB for an implanted drug delivery device.

Rigid-Flex PCBs

Combining the durability of rigid PCBs with the adaptability of flex PCBs, rigid-flex PCBs deliver robust performance in demanding environments. Ideal for applications where space is limited and conditions are dynamic, these PCBs ensure seamless integration and superior performance.

Ultra-Thin PCBs

Very thin double layer flex PCB with a thickness of 12 micrometers.

With ultra-thin dielectric thicknesses of 12 micrometers, our two-layer und multilayer flexible PCBs offer exceptional flexibility and reliability. These advanced PCBs are ideal for ultra-compact, cutting-edge electronics, ensuring superior signal integrity and performance.

Microsection of a 4-layer rigid PCB with 30 micrometers thin dielectric thickness.

Thin Rigid Core

Rigid PCBs featuring 30-micrometer thin cores and dielectric layers offer superior performance and space-saving benefits. Their construction, with multiple layers and intricate pattern, makes them exceptionally suited for high-density applications and miniaturized components or products.

Multilayer flex PCB with openings to achieve rigid-flex properties.

Flex with Openings

Multilayer flexible PCBs become quite rigid. By selectively reducing the number of layers in specific areas, these sections gain flexibility, while the whole PCB closely mimics the properties of a rigid-flex PCB. This design facilitates easier assembly on the rigid parts while ensuring high flexibility in the flexible sections. A flex with openings enables greater miniaturization compared to a rigid-flex PCB.

High Miniaturization PCBs

Ultra-HDI-Flex-PCB.

Unlock the potential of ultra-high-density interconnect (UHDI) technology with very small via diameters, narrow line and space widths, and thin flexible substrates. These advanced PCBs enable intricate designs and high component densities, ensuring superior performance in the most demanding applications. Perfect for cutting-edge electronic innovations.

Microsection of IC-Substrate with 14 layers.

Integrated Circuit (IC) substrates bridge the nanometer-scale world of integrated circuits with the micrometer-scale world of PCBs and are essential for chip packaging. They must have excellent thermal and electrical properties and support dense designs. Usually, IC Substrates are made with high-performance materials using advanced manufacturing technologies such as mSAP or SAP Technology.

Substrate-like PCB (SLP) manufactured with SAP-technology.

Substrate-Like PCB

Substrate-like PCBs combine the advantages of traditional PCBs with advanced semiconductor substrate technology. They support extremely fine lines and spaces, allowing for high-density interconnects and superior electrical performance, making them ideal compact and efficient electronic designs.

Specialty PCBs

Rigid-flex PCB featuring two distinct flex layers of varying lengths.

Separated Flex Layers

By separating flex layers in a rigid-flex PCB design, the flexibility of the flex areas is greatly enhanced. This permits tighter bending radii and improves resistance to dynamic bending and vibrations. Furthermore, flex layers can be free on one side, enabling the realization of different lengths for the flex layers, providing greater design versatility.

Multilayer rigid PCB with a cavity in the middle and castellations on the edges.

Cavity & Castellations

Rigid PCBs with cavities offer the advantage of placing components in recessed areas, which reduces the overall thickness of the device. This design also enables the complete encapsulation of electronic components, protecting them from environmental factors. Additionally, castellations, created by half-plated holes on the edges, facilitate easy solder on the PCB.

Detail of rigid PCB with flying leads.

Flying leads are conductive traces that extend from the PCB without being anchored to the board on both ends. These leads are particularly useful in testing and prototyping because they offer flexibility in connecting components that are not permanently fixed to the board. This allows for quick and easy connections and modifications.

Contact Us Today to Discuss How We Can Meet Your PCB Manufacturing Needs and Bring Your Innovative Designs to Life.

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