The table below outlines our production capabilities. Standard values represent typical capabilities achievable in regular production runs. Limit values indicate the maximum parameters which may result in lower yields and are subject to feasibility constraints due to multiple limiting factors. The actual manufacturability of your products will depend on its specific design.
| Description | Standard | Limit | |
|---|---|---|---|
| Traces and spaces (1) | 40 μm / 40 μm | 10 μm / 10 μm (2) | |
| Core thickness | Flex Rigid |
25 μm
30 μm |
12.5 μm |
| Number of layers | Flex Rigid |
8 16 |
10 40 |
| Micro vias | Laser Mechanical |
Ø 50 μm Ø 100 μm |
Ø 15 μm Ø 75 μm |
| Annular ring | Laser Mechanical |
Ø 50 μm Ø 100 μm |
Ø 20 μm Ø 75 μm |
| Via filling | Blind vias Through holes |
Copper Copper, epoxy |
|
| Solder mask width | 100 μm | 40 μm | |
| Materials | Flex (3) Rigid (4) |
PI, acrylic adhesive, epoxy adhesive FR 4, BT, PI, ABF |
|
| Final surfaces | ENIG, ENEPIG, DIG, electroplated gold, chemical silver, chemical tin, OSP |
We invite you to contact us to discuss your specific project needs. Together we can evaluate Design for Manufacturability (DFM) and develop tailored solutions to meet your goals.