First Serial Flex-PCBs in SAP-Technology Shipped

Key elements of this product are thin double layer flex-PCBs with traces one hundredth of a millimeter wide and plated with a thin gold layer in DIG-technology. These microscopic traces can only be manufactured with semi-additive-processing. To implement the SAP-technology substantial investments in equipment and the development of challenging processes were necessary. Since the beginning of this year we are proudly supplying Flex PCBs manufactured in SAP-technology for usage in a cutting-edge medical product on the market.